Heat dissipation mechanism

ABSTRACT

A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application claims priority of Taiwan Patent Application No.101215052, filed on Aug. 6, 2012, the entirety of which is incorporatedby reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipation mechanism, and inparticular, relates to a heat dissipation mechanism for a stackingsystem.

2. Description of the Related Art

Various external components such as a graphics processing units,memories, and hard disks can be connected to traditional notebookcomputers due to their compact dimensions. However, the externalcomponents all need heat dissipation devices, which increase productioncosts. Thus, decreasing the cost of heat dissipation devices, whilemaintaining efficiency has become an important issue in the field.

BRIEF SUMMARY OF THE INVENTION

The present invention provides a heat dissipation mechanism, comprisinga main casing, an air exhaust device, and at least a first sub-casing.The main casing includes an opening, an air outlet and a main joiningportion. The air exhaust device is disposed in the main casing toexhaust air through the air outlet from the main casing. The firstsub-casing includes a first through hole and a first joining portion,wherein the first through hole communicates with the opening and thefirst joining portion engages with the main connecting portion, so as tofix the first sub-casing to the main casing.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1 a and 1 b is a schematic view showing a main casing of a heatdissipation mechanism according to an embodiment of the invention;

FIGS. 2 a and 2 b is a schematic view showing a first sub-casing of aheat dissipation mechanism according to an embodiment of the invention;

FIG. 3 is a schematic view of a heat dissipation mechanism according toan embodiment of the invention;

FIG. 4 is a schematic view of a heat dissipation mechanism according toanother embodiment;

FIG. 5 is a schematic view of a heat dissipation mechanism according toanother embodiment of the invention t;

FIG. 6 is a schematic view of a heat dissipation mechanism according toanother embodiment of the invention;

FIG. 7 is a schematic view of a heat dissipation mechanism according toanother embodiment of the invention;

FIG. 8 is a schematic view of a heat dissipation mechanism according toanother embodiment of the invention;

FIG. 9 is a schematic view of a heat dissipation mechanism according toanother embodiment of the invention;

FIG. 10 is a schematic view of a main casing of a heat dissipationmechanism according to another embodiment of the invention; and

FIG. 11 is a schematic view showing an of a heat dissipation mechanismaccording to an embodiment of the invention;

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1 a to 3, an embodiment of a heat dissipationmechanism (FIG. 3) comprises a main casing 1 and a first sub-casing 2.As shown in FIGS. 1 a and 1 b, the main casing 1 comprises an opening10, an air outlet 5 and a main joining portion 11. The main joiningportion 11 projects from a surface of the main casing 1, and an airexhaust device 4 is disposed in the main casing 1. In this embodiment,the air exhaust device 4 may include a fan for exhausting air in themain casing 1 through the air outlet 5, wherein an electronic componentsuch as a graphics processing unit may also be disposed in the maincasing 1. As shown in FIGS. 2 a and 2 b, the first sub-casing 2comprises a first through hole 20 and a first joining portion 21,wherein the first joining portion 21 may be a recess formed on a surfaceof the first sub-casing 2.

Referring to FIG. 3, when the main casing 1 is engaged with the firstsub-casing 2, the main joining portion 11 is engaged with the firstjoining portion 21, and the first through hole 20 is communicated withthe opening 10. As the arrows indicate in FIG. 3, as the main casing 1is engaged with the first sub-casing 2, the fan 4 drives air from thefirst through hole 20, through the first sub-casing 2 and the maincasing 1 for heat dissipation. Subsequently, air is exhausted by the fan4 through an air outlet 5 on the top side of the main casing 1. In someembodiments, the air outlet 5 may also be disposed on other sides of themain casing 1.

Referring to FIG. 4, another embodiment of a heat dissipation mechanismcomprises a main casing 1 and two first sub-casings 2. As shown in FIG.4, the main casing 1 comprises two openings 10 and two main joiningportions 11, wherein the openings 10 and the main joining portions 11are respectively disposed on opposite sides of the main casing 1. Whenthe main casing 1 is engaged with the first sub-casings 2, the two firstsub-casings 2 are disposed on opposite sides of the main casing 1,wherein the two first joining portions 21 of the first sub-casings 2 arerespectively engaged with the two main joining portions 11, and the twofirst through holes 20 are respectively communicated with the twoopenings 10. After assembly, the fan 4 can inhales air from the firstthrough holes 20 for dissipating the heat inside of the two firstsub-casings 2, and air can be exhausted through an air outlet 5 on thetop side of the main casing 1 by the fan 4.

Referring to FIG. 5, another embodiment of a heat dissipation mechanismcomprises a main casing 1, a first sub-casing 2, and a second sub-casing3. The first sub-casing 2 has a hollow first joining portion 21 and aprotruding second joining portion 22, and the first joining portion 21and the second joining portion 22 are disposed on opposite sides thereofAs shown in FIG. 5, the second sub-casing 3 has a second through hole 30and a hollow third joining portion 31. The main casing 1, the firstsub-casing 2, and the second sub-casing 3 can be assembled, wherein themain joining portion 11 engages with the first joining portion 21, thesecond joining portion 22 engages with the third joining portion 31, andthe first through hole 20 communicates with the opening 10 and thesecond through hole 30. As a result, the fan 4 can inhale air from thesecond through hole 30 and dissipate heat sequentially through thesecond sub-casing 3, the first sub-casing 2, and the main casing 1.Subsequently, air is exhausted through an air outlet 5 on the top sideof the main casing 1 by the fan 4 (as arrows indicate shown in FIG. 5).

Referring to FIG. 6, another embodiment of a heat dissipation mechanismcomprises two main casings 1 and a first sub-casing 2, wherein the maincasing 1 on the right side of the first sub-casing 2 has a hollow mainjoining portion 11′ and two openings 10, and the main casing 1 on theleft side of the first sub-casing 2 has a protruding main joiningportion 11 and an opening 10. In this embodiment, a first joiningportion 21 and a second first joining portion 22 are respectivelydisposed on the right and left sides of the first sub-casing 2. When thefirst sub-casing 2 is connected to the two main casings 1, the mainjoining portion 11 is engaged with the first joining portion 21, thesecond joining portion 22 is engaged with the main joining portion 11′,and all the openings 10 of the main casings 1 are communicated with thefirst through hole 20 of the first sub-casing 2. After assembly, twofans 4 in the main casings 1 can inhale air from the opening 10 on theright side of the main casing 1 and dissipate heat through the airoutlets 5.

Referring to FIG. 7, another embodiment of a heat dissipation mechanismcomprises two main casings 1 and two first sub-casings 2. Two protrudinghollow main joining portions 11 are respectively formed on the oppositesides of the left main casing 1. The right main casing has a mainjoining portion 11 and a main portion 11′ on opposite sides thereof forengagement with the left main casing 1. The first joining portions 21are respectively formed on the two first sub-casings, and the firstjoining portions 21 are corresponding to the main joining portions 11.As shown in FIG. 7, the main casings 1 can be connected to each otherand the first sub-casings 2 can be disposed on opposite sides of the twomain casings 1 and respectively engaged therewith. Thus, air can enterthe heat dissipation mechanism through the first through hole 20,dissipating heat inside of the two main casings 1 and the firstsub-casings 2. Subsequently, air can be exhausted through air outlets 5on the top sides by the two fans 4.

Referring to FIG. 8, another embodiment of a heat dissipation mechanismcomprises two main casings 1 and two first sub-casings 2, wherein thetwo first sub-casings 2 are connected to each other. The two maincasings 1 are respectively disposed on opposite sides of the twosub-casings 2 and engaged with the first sub-casings 2. In thisembodiment, two air inlets 60 are respectively disposed on the two firstsub-casings 2, and air can enter the heat dissipation mechanism throughthe two openings 10 and the air inlets 60 for dissipating heat in thefirst sub-casings 2. Subsequently, air may be exhausted through the airoutlets 5 on the top side of the two main casings 1 by the fans 4.

Referring to FIG. 9, another embodiment of a heat dissipation mechanismcomprises two main casings 1 and two first sub-casings 2, wherein themain casings 1 and first sub-casings 2 are connected to each other andarranged in a staggered manner. In this embodiment, air can enter theheat dissipation mechanism through the first through hole 20 or the airinlets 60. Subsequently, air flows through the first sub-casing 2 andmain casing 1, and can be exhausted through air outlets 5 on the topside of the two main casings 1 by the fans 4.

Referring to FIG. 10, another embodiment of a main casing 1 may comprisetwo fans 4 for increasing the quantity of air flow. As shown in FIG. 11,a meshed structure 70 may be disposed on the opening 10 of the maincasing 1, and the ventilation area ratio of the meshed structure 70ranges from 30%˜50%. However, the meshed structure 70 may also bedisposed on the first through hole 20 of the first sub-casing 2 or thesecond through hole 30 of the second sub-casing 3 for preventing damageof the fan 4 due to unexpected impact from external objects.

Specifically, when the main joining portions 11, 11′, the first joiningportion 21, the second joining portion 22, and the third joining portion31 are engaged with each other, the mechanical strength between thecasings is improved, and electrical signals can be transmitted betweenthe electronic components in the casings through the joining portions.Thus, the heat dissipation mechanism can form a flow channel by engagingthe main casing with the sub-casing, so as to rapidly dissipate heat andimprove cooling efficiency of a stacking system.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A heat dissipation mechanism is provided, comprising: a main casing, including an opening, an air outlet and a main joining portion; an air exhaust device, disposed in the main casing to exhaust air through the air outlet from the main casing; and at least a first sub-casing, including a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing .
 2. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two first sub-casings, and the main casing further comprises two openings and two main joining portions, wherein the first sub-casings are respectively disposed on opposite sides of the main casing, the first joining portions of the first sub-casings are respectively engaged with the main joining portions, and the first through holes are respectively communicated with the openings.
 3. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises a second sub-casing and the first sub-casing further comprises a second joining portion, and the first and second joining portions are respectively disposed on opposite sides of the first sub-casing, and the second sub-casing includes a second through hole and a third joining portion, wherein the second through hole communicates with the first through hole, and the third joining portion engages with the second joining portion.
 4. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings, and one of the main casings comprises two openings, and the first sub-casing joining portions are respectively disposed on opposite sides of the first sub-casing and respectively engaged with the main casings, and the openings are communicated with the first through hole.
 5. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the main casings are engaged with each other, and the first sub-casings are disposed on opposite sides of the main casings.
 6. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the first sub-casings are engaged with each other, and the main casings are disposed on opposite sides of the first sub-casings.
 7. The heat dissipation mechanism as claimed in claim 1, wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings engaged with each other and arranged in a staggered manner.
 8. The heat dissipation mechanism as claimed in claim 1, wherein the main joining portion is engaged with and electrically connected to the first joining portion.
 9. The heat dissipation mechanism as claimed in claim 1, wherein the first sub-casing further comprises an air inlet, and air flows into the first sub-casing through the air inlet.
 10. The heat dissipation mechanism as claimed in claim 1, wherein the main casing further comprises a meshed structure, disposed in the opening, and the ventilation area ratio ranges from 30%˜50%. 